Thermoelectric Cooling Module TM 31-1.0-2.0

TM 31-1.0-2.0 Thermoelectric Cooling Module

Specifications with Thot = 27 °С

Part Number

Imax
A

Umax
V

Qcmax
W

∆Tmax
K

Dimensions (mm)
L x W x H

TM 31-1.0-2.0

2.0

3.8

4.4

70

15 x 15 x 4.7

 

Ideal for stabilizing the temperature, and wavelength, of a detector or sensor at a temperature near ambient.

TM 31-1.0-2.0 may be used for cooling, heating (up to 200 °C) and for thermal stabilization.

Normally used in a electro-optic & photonic applications. May be used in hand-held, battery operated and other low-power devices. A version for thermal cycling is available and recommended for wingtip applications.

 

Comprehensive Specifications (Hot-Side Temperature 27 °C)

Imax = 2.0 Amps (Imax is the maximum current at ΔTmax)

Vmax = 3.8 Volts (Vmax is maximum voltage at ΔTmax)

Qcmax = 4.4 Watts (Qcmax is maximum cooling capacity at Imax, Vmax and ΔT = 0 °C)

ΔTmax = 70 °C (ΔTmax is maximum temperature difference at Imax, Vmax and Qc = 0W)

Internal resistance = 1.65 Ω ± 10% as measured by AC 4-terminal method at 25 °C

Operating temperature range: -50 °C ~ +200 °C (Solder melting point: +235 °C)

Thickness tolerance: ± 0.025mm (Lapping to ± 0.01mm available.)
Flatness and parallel variance: ± 0.05mm

Standard lead wires: 22 AWG, Tin (Sn) plated at module interface, with a maximum temperature of +105 °C
(Other wiring options available.)

Maximum recommended compression: 1MPa

Ceramics: Alumina (AL2O3)
Metalized (and tinned) surfaces available

The lot number is printed on the center of the cold-side

RoHs Compliant

Options & Designations (Suffix):
(for example: TM 31-1.0-2.0 "EL")

performance curves

Thermoelectric module performance curves are graphical representations showing the relationships between power applied and net cooling for a specific TE module.

Performance curves are valuable tools for quickly determining if a TE module is a suitable COOLER for an application; learning what power is required for an appropriate module to reach the desired temperature and heat pumping capacity; and to provide the basic information necessary for proper assembly design.

Curves with Th = 27 °C indicate what to expect operating a well designed, fan cooled, assembly in ambient temperatures around 20 °C (70 °F) with an operational "hot-side" temperature or "Th" about 7 °C above ambient.

Curves with Th = 50 °C indicate performance expectations from assemblies with (relative) ambient temperatures in the 40-50 °C range. This includes assemblies with limited heat-sinking space yielding hot-side temperatures about 30 °C above ambient, marginally ventilated enclosures, outdoor, box-in-box, and other applications with warm temperatures around the hot-side of the TE assembly.

 

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